Other (free input) SBB-410 Others

Others Other Tools Publication Date: February 11, 2025 Print (Without Logo) Print (With Logo)

Stock ID 11621
Stock Code N10398
Manufacturer 新川
Model Type SBB-410
Year 2004
Main Specifications

Bonding method: Ball bonding method using ultrasonic thermocompression, Bonding area: 25mm x 2 stages, Wire diameter: Gold wire for bumps φ18~32μm 2 inch double flange spool, Number of bonding wires: Maximum 2000 bumps (for 1 type), Stored types: 8 types (for 2000 bumps) 40 types (for 200 bumps), Target die dimensions: External diameter 1.5~20mm, Thickness: 0.3~0.6mm, Power source: Input power supply AC100V50/60Hz Power consumption approx. 800W Air 490kPa 50ℓ/min Vacuum -74kPa or less, Equipment dimensions and weight: 920Wx1030Dx1860Hmm approx. 550kg★

Location Ibaraki Prefecture