5278 entries, 2177~2192 shown Card View
Category Name  Manufacturer Name  Model Type  Year  Main Specifications Location  Owner 
旭硝子 202-PS Others N344 Image Others 旭硝子 202-PS Unknown
Fiber φ6×1★
Ibaraki Prefecture
TokyoEngineering
Details
 UV LIGHT SOURCE HLS210U Others N352 Image Others UV LIGHT SOURCE HLS210U Unknown
Fiber φ3×4★
Ibaraki Prefecture
TokyoEngineering
Details
牧野鉄工所 BM-200(湿式) Others N1843 Image Others 牧野鉄工所 BM-200(湿式) 1988
Capacity: 420 liters, Rotation speed: 31 rpm (60 Hz), Lining: Ceramic tile, Motor 2.2 Kw 400 V specifications ★
Ibaraki Prefecture
TokyoEngineering
Details
 VIR650 Others N9478 Image Others VIR650 Unknown
6inch Power cables missing
Ibaraki Prefecture
TokyoEngineering
Details
 IM-80  +  LEICA  INM100 Others N9472 Image Others IM-80 + LEICA INM100 Unknown
6inch: Error during initialization
Ibaraki Prefecture
TokyoEngineering
Details
ALCATEL ASM192T2D+ Others NS0062 Image Others ALCATEL ASM192T2D+ 2006
Ibaraki Prefecture
TokyoEngineering
Details
堀場アドバンステクノ HF-96(変換器)+  FS-10(検出器) Others NS0003 Image Others 堀場アドバンステクノ HF-96(変換器)+ FS-10(検出器) 2013
Measurement range HF concentration: 0 to 5000 ppm Separate specification document 1 (PDF) available
Ibaraki Prefecture
TokyoEngineering
Details
キャノンマシナリー BESTEM-D01R Others N11985 Image Others キャノンマシナリー BESTEM-D01R Unknown
Ibaraki Prefecture
TokyoEngineering
Details
 BESTEM-D01R Others N11984 Image Others BESTEM-D01R Unknown
Ibaraki Prefecture
TokyoEngineering
Details
YAMAHA i-CubeⅡ Others N10714 Image Others YAMAHA i-CubeⅡ 2005
KGV-000★
Ibaraki Prefecture
TokyoEngineering
Details
PANASONIC FCB3 Others N10463 Image Others PANASONIC FCB3 2005
Please see attached specifications★
Ibaraki Prefecture
TokyoEngineering
Details
新川 SBB-410 Others N10398 Image Others 新川 SBB-410 2004
Bonding method: Ball bonding method using ultrasonic thermocompression, Bonding area: 25mm x 2 stages, Wire diameter: Gold wire for bumps φ18~32μm 2 inch double flange spool, Number of bonding wires: Maximum 2000 bumps (for 1 type), Stored types: 8 types (for 2000 bumps) 40 types (for 200 bumps), Target die dimensions: External diameter 1.5~20mm, Thickness: 0.3~0.6mm, Power source: Input power supply AC100V50/60Hz Power consumption approx. 800W Air 490kPa 50ℓ/min Vacuum -74kPa or less, Equipment dimensions and weight: 920Wx1030Dx1860Hmm approx. 550kg★
Ibaraki Prefecture
TokyoEngineering
Details
Thermo Electron HX  300 Chiller/Cooling Tower N10446 Image Chiller/Cooling Tower Thermo Electron HX 300 Unknown
Recirculating Chiller ★
Ibaraki Prefecture
TokyoEngineering
Details
 HX  300 Chiller/Cooling Tower N10445 Image Chiller/Cooling Tower HX 300 Unknown
Recirculating Chiller★
Ibaraki Prefecture
TokyoEngineering
Details
 HX+300A Chiller/Cooling Tower N10444 Image Chiller/Cooling Tower HX+300A Unknown
NESLAB Recirculating Chiller★
Ibaraki Prefecture
TokyoEngineering
Details
 HX+300A Chiller/Cooling Tower N10443 Image Chiller/Cooling Tower HX+300A Unknown
NESLAB Recirculating Chiller★
Ibaraki Prefecture
TokyoEngineering
Details